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|VF:||1.3V||Operating Junction Temperature:||-55 To +150℃|
ultrafast recovery diode,
ultra fast recovery diode
SMD Fast Recovery Rectifier Diode RS1AL Thru RS1ML With SOD-123FL Case
Glass Passivated Divice
Ideal for surface mouted applications
Low reverse leakage
Metallurgically bonded construction
High temperature soldering guaranteed: 250 C/10 seconds,0.375”(9.5mm) lead length,
5 lbs. (2.3kg) tension
Case : JEDEC SOD-123FL molded plastic body over passivated chip
Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight :0.0007 ounce, 0.02 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating 25 C ambient temperature uniess otherwies specified.
Single phase half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
|Maximum Recurrent Peak Reverse Voltage||VRRM||50||100||200||400||600||800||1000||V|
|Maximum RMS Voltage||VRMS||35||70||140||280||420||560||700||V|
|Maximum DC Blocking Voltage||VDC||50||100||200||400||600||800||1000||V|
|Maximum Average Forward Rectified Current @TA=65 ℃(Note 1)||I(AV)||1.0||V|
Peak Forward Surge Current, 8.3 ms single half sine-wave
superimposed on rated load (JEDEC method) TL=25 ℃
|Maximum Instantaneous Forward Voltage at 1.0A DC||VF||1.3||V|
Maximum DC Reverse Current Ta=25℃
at Rated DC Blocking Voltage Ta=100℃
Maximum Reverse Recovery Time
Typical Junction Capacitance
|Typical Thermal Resistance (Note 4)||RθJA||180||K/W|
|Operating Temperature Range||TJ, TSTG||-55--150||℃|
3.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
1.Averaged over any 20ms period.
2.Measured with IF=0.5A, IR=1A, Irr=0.25A.
4.Thermal resistance junction to ambient, 6.0 mm2 coppeer pads to each terminal.
Parts are usedinside all electronic products, such as Alarm, Computer, TV, Camera, Watch, e Phone,
Speaker, MP3/MP4 Player, Electric Toy, VCD/DVD Player, Telecommunication, Wireless Control and
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Contact Person: Bixia Wu